FLANDERS, NJ- Rudolph Technologies , a provider of process characterization equipment and software for the semiconductor manufacturing industry, has received multiple orders for its NSX Inspection System from a European semiconductor manufacturer. The equipment will be used in back-end manufacturing for high-throughput inspection of automotive semiconductor devices at key points in the process. Shipments will commence in the first quarter of 2011 and continue through the second quarter.
The NSX115 Automated Inspection System is designed for the back-end manufacturing environment and detects and analyzes macro defects.
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