Flanders, NJ- Rudolph Technologies Inc., a provider of process characterization equipment and software for wafer fabrications and advanced packaging facilities, has received multiple system orders from a major Asian foundry and an integrated device manufacturer with fabrication facilities in the United States for its latest MetaPULSE-G opaque metrology tool. Shipments to fulfill these orders are scheduled for Q4 ’10 through Q3 ‘11.

The MetaPULSE-G tool is Rudolph’s latest addition to the MetaPULSE line of opaque thin film thickness measurement systems. “Interconnect metrology is becoming more challenging as our customers move to the 32 nanometer process node and below,” says Tim Kryman, Rudolph’s metrology business product manager. “Thinner interconnect layers are driving needed improvements in film stack measurement precision and repeatability.”