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Omron provides appropriate inspection solutions to meet the inspection needs of all sizes of circuit board manufacturers, including table-top systems, in-line systems, high-throughput models and X-ray based models for concealed solder joints and double-sided boards.
The VP 6000 is a 3-dimensional solder paste inspection (SPI) system capable of inspecting 100% of solder paste deposition at in-line speeds. Utilizing structured light to perform 3-D inspections and its unique method of automatically adjusting the Z-Axis for board warpage, the VP6000 is capable of producing extremely accurate and repeatable inspections. The system easily programs in less than 15 minutes with the importing of a single Gerber file and a CAD placement file. The VP6000 system also includes a full complement of SPC charts and graphs in the standard offline programming station.
The VT-RNS table-top and in-line AOI systems deliver high-performance inspection capability in a cost effective platform. The VT-RNS uses Omron’s patented, proven Color Highlight system which delivers superior solder joint illumination by providing 3-dimensional information from a 2-dimensional image. This Color Highlight system utilizes RGB LEDS in a dome configuration which ensures consistent inspection regardless of component angles. The 3-CCD camera used in the system enhances solder shape recognition accuracy by obtaining three times the information of a conventional 1-CCD camera delivering robust inspection results down to 10 microns resolution. Combined with EzTS software, this solution can dramatically reduce setup and changeover time allowing more production uptime and lowering quality inspection costs.
Omron’s comprehensive line of AOI and AXI inspection equipment from table-top to in-line systems provide a total SMT solution fully compatible with the Q-upNavi Software suite designed for Root Cause Analysis and total SMT quality improvement.