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The purpose of the project, supported by $83 million from the Canadian government and $95 million from the Quebec government, is to create a global center of excellence for research and innovation in microelectromechanical systems (MEMS) and 3-D Wafer Level Packaging (WLP) as well as advanced technologies associated with the assembly and packaging of silicon chips.
Dalsa is excited to be a founding partner in the innovation center along with IBM Canada and Université de Sherbrooke. The initial founding partners, along with various semiconductor equipment suppliers, and others that may join at a later date, will provide financial and in-kind support to the project for ongoing operations.
As a founding partner, Dalsa, a supplier of MEMS foundry services, will assist in the design of the center, and take a lead role in the specification, installation and ongoing operational responsibility for the MEMS and WLP related equipment. The prime purpose of the innovation center is to leverage the best from the Canadian and international research community to address industry's most challenging problems. The end goal is technology transfer as well as development of spinoffs. The center has already received letters of interest from universities, research centers and other industrial partners from across Canada and around the world.