Rudolph Technologies Receives Multiple System Order for Inspection Module
May 12, 2008
FLANDERS, NJ, May 8-Rudolph Technologies Inc., provider of process characterization solutions for the semiconductor manufacturing industry, has received multiple system orders for its recently introduced AXi 940 macro defect inspection module from a chip manufacturer based in Singapore. Two systems were shipped in April, with the third scheduled for June.
“The size of the order puts us ahead of our own projections for this tool,” says Scott Balak, AXi inspection product manager, “but more significantly, it affirms the design choices we made and the value this customer recognizes in the resulting product. Clearly, the productivity, accuracy and reliability of the new tool were apparent in this evaluation, and we expect rapid adoption of the AXi 940 in these important market segments.”