Quality Magazine

Solder Paste Inspection

March 2, 2009


The VP5000 in-line 3-D solder paste inspection system helps increase the throughput of 100% quality inspection of solder paste on printed circuit boards. The unit’s large field of view reduces the number of images required to inspect the board, reducing cycle time. Navigation through the system’s capabilities has been simplified by using tabbed menus in the touch screen interface to shorten inspection setup, operation monitoring and production changeover. Capabilities such as the addition of warning thresholds to the pass/fail outputs allow for preventive action that reduces waste. The unit comes with an interface to proprietary software that enables the height calculation and volumetric inspection data to be incorporated into a root cause of failure analysis.