Issue 3, Mar. 2011

From the Quality Archives

50 Years of Quality: A Look Back at Laser Measurement
In this month’s edition of 50 Years of Quality, we take a look at how Quality has covered the relatively new technology of laser measurement over the years. READ MORE

White Paper: Wafer Manufacturing and Laser Displacement Sensors
Major driving forces in today’s semiconductor industry are reduction of manufacturing costs and increase in efficiency. In the past, laser displacement sensors were used infrequently due to lack of speed, accuracy and flexibility. Recently, these sensors have become more accurate (0.02 μm repeatability), faster (392 kHz sampling rate) and more flexible. This paper discusses breakthroughs in design and performance that have accelerated their use in the inspection and control of ingot and wafer dicing, wire bonding, and in the final packaging process. Common applications include high-accuracy positioning, flatness, and eccentricity. Typical examples, data and advances in technology are discussed. Download White Paper

From the Quality Archives

3-D Laser Scanning Accelerates Inspection
3-D laser scanning, which has matured during the past 10 years, is on the verge of revolutionizing the micrometrology market in automotive, aerospace and many other markets. Laser scanners accurately capture parts of various shape, size and material in a fraction of the time required for touch-probe measurement, resulting in increased inspection productivity. READ MORE

From the Quality Archives

Laser Tracking Transforms Efficiency
One of the world’s leading helicopter manufacturers, Eurocopter has improved production line efficiency by up to 70% in just a few years with the implementation of two laser tracker measurement systems. According to Reinhold Grosskopf, head of workshop development, the deployment of the two laser trackers for quality assurance purposes at Eurocopter’s production plant in Donauwörth, Germany, has changed technical measurement procedures. READ MORE