Quality Magazine

Rudolph Ships New Equipment to Measure Metal Film Thickness in LCD Panels

July 16, 2012

FLANDERS, NJ-Rudolph Technologies said it has sold the first of its new MetaPULSE FP thin film metrology systems used to measure the critical thickness of metal layers deposited during the manufacturing process of flat panel displays such LCD panels.

“The MetaPULSE FP system is a unique solution that allows for measurement of critical metal film thicknesses on actual product structures without contacting or destroying the device,” says Dr. Avishai Kepten, vice president and general manager of Rudolph’s Metrology Business Unit. “The first tool is being qualified on an R&D line, and we believe the capability will be indispensable as our customer ramps to high-volume production.”

Rudolph’s director of metrology product management, Tim Kryman, said, “For many years MetaPULSE technology has been the ideal solution for measuring the thickness and other properties of thin metal films in semiconductor manufacturing applications. The new FP system combines a MetaPULSE measurement head with customized glass substrate handling to extend this critical measurement capability to the much larger substrates used to make flat panels. This MetaPULSE FP tool was delivered and installed in the second quarter and is being used for measurements on 4.5 generation substrates, which are used to make displays for e-readers, tablets, phones and other mobile devices. We are also in discussions with manufacturers of much larger panels used for television displays.”