June 4, 2009
The Thick-800 X-ray fluorescence (XRF) analyzer measures plating thickness and provides measurements of single-layer, multi-layer and thin-film coatings and solders with composition. The unit has a top-down measurement system, which allows for a sample stage with 3-D movement. The top-down measurement system also allows for a three-sided chamber door, so that operators can measure smaller samples with the door closed or open the door to create a slotted chamber for larger samples. To ensure sample alignment accuracy, the unit was developed with a color-camera sample viewing system and double laser position technology.