The fabrication of metal components generally requires some type of machining operations. The exposed surface after the machining operation can expose internal features that might be of concern for different reasons. The isolation and identification of the flaws requires a quality standard that is defined by a specification.
SRC and an environmental research center employ real-time monitoring to slash water and energy usage for semiconductor manufacturing. Thirty percent reduction in wafer surface cleaning requirements can benefit manufacturing sustainability for both 300-millimeter and 450-millimeter processes.
AVEVA announces the release of a new business paper for the process and power industries highlighting the need to maximize the efficiency of plant design and shares its industry insight to help reduce project costs while improving quality in engineering, procurement and construction.