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Zygo Corporation announced that its Semiconductor Advanced Packaging Systems group has been awarded an order valued in excess of $3 million from a major Asian IC substrate manufacturer to deliver multiple state-of-the-art High Volume Manufacturing (HVM) 3D/2D metrology systems for production process monitoring and product yield enhancement.
Visualize the large tool, the cabinet of Figure 1, being on your company’s or agency’s premises. What is it? What can you use it for? It’s mainly intended for stressing, for finding weaknesses in, your electronic and other assemblies.
Though FaciliWorks CMMS is already used by hundreds of Mexican companies, there is still an enormous number of potential clients who are in need of a system like FaciliWorks.
The advancement of different digital technologies is one of the main drivers for the development of image sensors. Functions that were previously independent or could not be integrated can currently be packed into one device.
Just as a recipe designed for four may require some changes if it is called upon to serve 4,000, dramatically up-scaling the number of quality metrics being monitored may demand new approaches when deploying SPC.
While advancements in automation and technology have enabled efficient acquisition of large volumes of nondestructive examination (NDE) data, the advancements in the analysis of collected data have been largely stagnant.
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