SMIC Announces Formation of Center for Vision, Sensors and 3DIC
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SHANGHAI -- Semiconductor Manufacturing International announced the formation of SMIC's Center for Vision, Sensors and 3DIC (CVS3D). CVS3D consolidates and strengthens SMIC's R&D and manufacturing capabilities for silicon-based sensors, thru-silicon-via (TSV) technology and other middle-end wafer process (MEWP) technologies. MEWP technology has led to significant advancements in CMOS image sensors, MEMS sensors, 3D stacked devices, and high performance TSV-based 2.5D and 3D systems-in-package (SiP).
The semiconductor industry is rapidly adopting TSV-based 2.5D and 3DIC technology in order to further miniaturize system ICs while reducing power consumption and boosting device and system performance. Market research [1] forecasts global TSV wafer shipments to be around 1.35 million 12" wafers in Y2013, expanding to 9.58 million 12"wafers by Y2017, representing a 63% CAGR over the next 5 years. In particular, by Y2017, close to 63% of wafer demand will be for Logic 3D SiP/SoC, MEMS Sensors, RF/Mixed Signal, and CIS-related ICs, all of which are essential for today's smartphone and mobile computing applications.