CHICAGO – Flextron Circuit Assembly added 3D Solder Paste Inspection (SPI) capability and Automated Optical Inspection (AOI) to its PCBA manufacturing lines to enhance quality and reliability in its finished electronic assemblies.
Flextron deployed two 3D SPI systems from Koh Young Technology in addition to post-soldering Automated Optical Inspection (AOI) provided by a Nordson YESTECH F1S AOI system. The two KY8030-2 full 3D SPI systems provide inspection for defects and measurement data of printed solder paste, identifying defects such as insufficient paste volumes, missing prints, and print registration errors.