Rudolph Technologies, Inc. announced that it has received orders for 12 of its Dragonfly™ G2 system, just months after releasing the product. Several systems were delivered in the fourth quarter to the largest OSAT where the Dragonfly G2 systems displaced incumbent 3D technology and retained the Company’s market leadership in 2D macro inspection. The remaining systems will ship in the first half of 2019 to OSAT, IDM, and Foundry customers who are adopting the Dragonfly G2 platform for its high productivity in two-dimensional (2D) inspection, and its accuracy and repeatability in three-dimensional (3D) inspection of the smallest copper pillars. The Company expects additional adoptions of the Dragonfly G2 system across multiple key market segments in the first half of 2019, which validates Rudolph’s collaborative R&D approach with its key customers.
The new Dragonfly G2 platform delivers up to 150% improvement in productivity over legacy systems as well as exceeds competitive system throughputs. Its modular architecture provides a flexible platform with plug-and-play configurability to combine 2D with 3D Truebump™ Technology for accurate copper pillar/bump height measurements. Clearfind™ Technology detects non-visual residue defects and advanced sensor technology measures 3D features and CD metrology. Additionally, the Dragonfly G2 platform has been specifically architected to allow the measurement, data collection, and analysis of bump interconnects nearing 100 million bumps per wafer using Rudolph’s Discover® software and advanced computing architecture.