Teledyne Imaging’s Virtual Event to Showcase Latest Industrial Imaging Solutions
Teledyne Imaging announce it will host a multi-session virtual event November 17-19 to introduce its newest and most innovative imaging solutions. Online sessions led by subject matter experts from across the Teledyne Imaging group will cover topics such as machine learning and AI, extreme high-resolution and high-speed imaging, 3D sensing, non-visible and multi-spectral imaging, and high-volume, low-cost CMOS sensors.