ISO 13485 Awarded to ON Semiconductor for its Advanced Packaging Facility
ON Semiconductor (ONNN), driving innovation in energy efficiency, has announced that its Burlington, Canada advanced packaging facility has received ISO 13485:2003 certification, the international quality management system standard for the design and manufacture of medical devices. The 95,000-square-foot purpose-built plant, which employs 135 people, specializes in the design and manufacturing of highly miniaturized System-in-Package (SiP) custom assemblies for use in implantable and body-worn medical devices.
“Miniaturization is a key trend in medical devices; by integrating multiple die and discrete components manufactured with diverse technologies in a stacked architecture, significant space savings and improved system performance is achieved,” said Robert Tong, vice president of ON Semiconductor's Medical Division. “Manufacturers designing applications such as hearing aids, continuous blood glucose monitors and implantable defibrillators are constantly challenged to find new ways to further reduce the size of their devices, driving demand for innovative packaging approaches.”