Hitachi High-Tech Analytical Science has expanded its plating and coatings analysis range with the launch of the breakaway FT230. The new FT230 is designed to enable quality control to keep pace with production by significantly simplifying and accelerating testing of components and assemblies. Removing the traditional hurdles of XRF analysis, the FT230 speeds up analysis and reduces costly errors to help electronics and component-level manufacturers, general metal finishers and plating-on-plastic facilities achieve 100% inspection and meet tightening specifications.
Every aspect of the FT230 was designed to reduce the amount of time it takes to complete an XRF measurement. With traditional XRF instruments, around 72% of testing time is lost on set up, meaning that operators spend significantly more time preparing a measurement and manipulating the results than the instrument spends analyzing the part. The user experience (UX) of the FT230 is significantly improved by an intelligent part recognition feature called Find My Part™ that automatically selects the features that need to be measured, the analytical routines and reporting rules so the operator spends less time using the XRF and more time working the results. The on-board, user-built library is easily expanded to handle new parts and new routines as your work changes.