INSPECTIS’ BGA inspection systems can now be supplied with optional new XM lenses that offer up to 285x screen magnification, compared to the original standard lens with 200x.
The next-generation Vanta™ handheld XRF analyzers—Vanta Max and Vanta Core—deliver improved elemental analysis and material identification using smart and cloud-connected technology.
Renishaw has expanded its RenAM 500 series with the launch of the RenAM 500 Ultra AM system, cutting build times by up to 50 percent without compromising on quality, and giving metal additive manufacturing (AM) users the tools to produce parts faster.
All three of the Rockwell Automation ControlLogix analog motion modules, 1756-HYD02, 1756-M02AS, and 1756-M02AE, have reached end-of-life and, as of December 2024, will be discontinued and no longer available for sale.
Teledyne DALSA announced its Xtium™2-XGV PX8, a GigE Vision® compatible image acquisition board that features a real-time depacketization engine to convert GigE Vision image packets into ready-to-use images.