When processes fail unexpectedly, companies face irrecoverable loss of revenue and profit, not to mention the potential for irreparable damage to their brand. Failures are multivariate: they can be found in individual parts, entire machines, or within a process.
The Thick-800 X-ray fluorescence (XRF) analyzer measures plating thickness and provides measurements of single-layer, multi-layer and thin-film coatings and solders with composition.
The Niton XL3t Series X-ray fluorescence (XRF) handheld analyzer is now available with geometrically optimized large-area drift detector (GOLDD) technology.