The MultiBeam is a high-throughput SEM/FIB that combines focused ion beam micro milling with high-resolution imaging. The tool is for IC defect analysis, circuit modification, TEM thin film sample preparation and mask repair. The instrument has serial slicing and sampling (S3) for in-process monitoring of milling, fabrication and reconstructing 3-D images of the sectioned area. A maximum milling current of 30 nanoamperes ensures high throughput milling of large areas. The tool also has low vacuum operation for nonconductive specimens without coating or alteration, a gas injection system for etching and deposition, a large stage for up to 150-millimeter samples and a multiple port design for a range of analytical needs. Samples are loaded through a standard airlock system.