HUNTSVILLE, AL--SigmaTech's UltraMap-TSV system won Best of West at SEMICON West, presented by industry association SEMI and Solid State Technology.
The UltraMap-TSV system from SigmaTech is a fully automated through silicon via (TSV) and deep-trench metrology system capable of characterizing both TSV and deep-trench features from both the front and back sides of subject wafers, up to 300 millimeters in diameter.
The winner was chosen by a prestigious panel of judges representing a broad spectrum of the microelectronics industry.
SigmaTech TSV Metrology Wins Best of West
July 19, 2011