BENBROOK, TX –– The Coordinate Metrology Society (CMS) today announced its call for papers is now open for the 29^th annual Coordinate Metrology Systems Conference (CMSC) to be held July 22 - 26, 2013 in San Diego, CA. The CMS is the eminent membership association for measurement professionals around the globe. The organization cordially invites its community members and metrology professionals in manufacturing, science research, and academia to submit abstracts for technical papers and presentations.  The CMS accepts submissions covering the successful deployment of 3D coordinate measurement systems, industry best practices, and scientific research and developments. The Coordinate Metrology Society convenes each year at the CMSC, a unique event designed for users of portable, high-precision measurement technology utilized to inspect manufactured and assembled components on the factory floor.

The CMS Executive Committee peer-reviews and considers each abstract for presentation at CMSC 2013. The deadline for abstracts is March 15, 2013. Notification of acceptance will occur on April 1, 2013. For more information about presenting a technical paper at CMSC 2013, contact Michael Raphael, Technical Presentations Coordinator at [email protected]. Guidelines for presentations and technical papers can be downloaded at 2013 CMSC Guidelines. The CMS Executive Committee appraises all technical papers presented at the CMSC, and selects the conference’s best papers for publication in The Journal of the CMSC.

At CMSC 2012, 26 expert presentations were delivered by industry leaders from The Boeing Company, GKN Aerospace, NIST, Lockheed Martin, Hitachi Engineering & Services, ISRO Satellite Centre, Clemson University, Argonne National Laboratory, Schneider-Electric, Dassault Systemes, U.S. Army Research Laboratory, U.S. Navy Reverse Engineering Laboratory, National Research Council of Canada, Leibniz University Hannover, and other companies and educational institutions covering technology, theory, and practice to advance the field of 3-D metrology.