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A new control platform for Sigma Systems’ cryogenically and mechanically cooled thermal chambers and plates has been introduced by Thermonics.

This high power X-ray source enables non-destructive inspection or measurement of large or dense objects such as engine castings, turbine blades, large composite parts with unprecedented resolution.

X-RAY WorX has developed an innovative internal cooling for microfocus transmission tubes of the new product line TCNF.

Olympus announced the introduction of the RollerFORM, a new ultrasound phased array wheel probe that has been specifically developed to facilitate high-quality, immersion-like ultrasonic testing of composites and other smooth-surfaced materials that are commonly used in the aerospace industry.

Sonobond’s ultrasonic technology provides an ultrasonic system capable of welding the tin-coated wires and terminals essential to electrical applications for high-temperature, high-humidity and other environmentally challenging conditions.

The PIXCI E4G2 is a four camera frame grabber with a PCI express x 4 bus. It captures from two 80 bit cameras or four base Camera Link cameras.

Renishaw launches ATOM, a non-contact optical linear and rotary incremental encoder system that combines miniaturization with dirt immunity, signal stability and reliability.

IDS Imaging Development Systems is building upon the success of its USB 3.0 uEye CP series of machine vision cameras by introducing three new models with lightning-fast USB 3.0 technology.

Zeiss’ new Crossbeam series features include high speed in materials analysis and processing and its wide diversity of applications.

Teledyne DALSA’s Semiconductor Foundry, a division of Teledyne Technologies, announced the availability of its DH0357AQ Electrostatic Actuator High Voltage IC.