Silicon wafers accumulate residual stress during the growth, sawing, grinding, etching and polishing process.

NIST researchers created a chip on which laser light interacts with a tiny cloud of atoms to serve as a miniature toolkit for measuring important quantities such as length with quantum precision. The design could be mass-produced with existing technology.

Teledyne DALSA introduced its newest Genie Nano cameras built around ON Semiconductor’s Python P3 1.3M CMOS image sensors. These new models feature a global shutter, with 1280 x 1024 resolution, and image capture of up to 83 frames-per-second with Teledyne’s TurboDrive technology.