FLANDERS, NJ — Rudolph Technologies Inc. announced that it has received a large order from one of Taiwan’s providers of independent semiconductor manufacturing services in assembly and test (OSAT). The order includes multiple NSX systems for two-dimensional (2D) macro defect inspection; the Wafer Scanner Inspection Series for three-dimensional (3D) inspection and bump height metrology; and Discover software for yield optimization.
“The importance of advanced packaging processes continues to grow as semiconductor manufacturers seek to pack more power and capability into smaller and smaller packages,” said Mike Goodrich, vice president and general manager of Rudolph’s Inspection Business Unit. “We provide a comprehensive solution to help our customers ensure the performance of these challenging new processes. The Wafer Scanner system provides fast 3D inspection and measurement of bumping processes and the NSX system delivers high-throughput 2D inspection of complex patterns and components such as redistribution layers (RDL) and under bump metal. The Discover software ties it all together with sophisticated yield enhancement capabilities.”
“By providing an intelligent, comprehensive solution we were able to reduce the amount of review and improve the net throughput and net utilization in the factory. Our Fleet Management capabilities include recipe management and ensure consistent performance across multiple systems,” Goodrich added.
For more information, visit www.rudolphtech.com.