FLANDERS, NJ-Rudolph Technologies Inc., provider of process characterization equipment and software used in wafer processing and semiconductor final manufacturing (back-end) facilities, announces that it has acquired all intellectual property and selected assets from privately-held RVSI Inspection, headquartered in Hauppauge, NY. The addition of RVSI’s industry-standard WS-3800 3D bumped wafer inspection system to its product portfolio is expected to strengthen Rudolph’s established presence in the high-growth, advanced packaging market.

“We are pleased to announce the close of this transaction,” says Paul F. McLaughlin, chairman and chief executive officer of Rudolph. “This purchase, as well as our recently-announced acquisition of Applied Precision’s probe card test and analysis business, was orchestrated to enhance our position as a dominant supplier of inspection and metrology solutions for an increasing number of back-end applications.

“The RVSI WS-3800 tool is the perfect complement to the Rudolph NSX 2D macro defect inspection system, which is the workhorse tool-of-choice deployed in most of the leading labs around the world,” McLaughlin continues. “We believe these high-performance systems will give our customers a comprehensive solution for both 2D and 3D inspection.”