Wafer-level CSP (Chip Size Package) is a technique of packaging an integrated circuit at wafer level. CSP facilitates high-density mounting without wire bonding. In the case of wafer-level CSP, a wafer goes through several semiconductor manufacturing processes, including forming electrode terminals, attaching solder balls, and resin encapsulation. 

Lithium-ion batteries charge and discharge because their lithium ions can move in both directions between positive and negative electrodes.

The Schmidt Class IV laser is designed for larger part marking applications that make enclosing the laser impractical. 

Nondestructive Testing (NDT) based on laser technology has witnessed incremental acceptance in the NDT industry since the early 1990’s with shearography and holography interferometry as the most widely recognized techniques based on this technology.

Multisensor systems have come a long way since the introduction of video measurement back in the 1970s.