This article emphasizes the need for efficient wafer inspection in semiconductor manufacturing to maximize throughput and minimize defects. It highlights that modern methods must combine speed with sensitive defect detection, with advanced machine vision technology being crucial for identifying macro defects early in the production process to avoid costly issues in finished components.
IXYS UK Westcode, part of the global power semiconductor manufacturer, IXYS Corporation, is investing in its Chippenham, UK, factory to manufacture a new range of power semiconductor devices, which will be marketed alongside the company’s long-established Press-Pack Capsules (three-terminal power semiconductor devices).
Zygo Corporation announced that its Semiconductor Advanced Packaging Systems group has been awarded an order valued in excess of $3 million from a major Asian IC substrate manufacturer.
ON Semiconductor (ONNN), driving innovation in energy efficiency, has announced that its Burlington, Canada advanced packaging facility has received ISO 13485:2003 certification, the international quality management system standard for the design and manufacture of medical devices.