MIDDLEFIELD, CT—Zygo Corporation announced that its Semiconductor Advanced Packaging Systems group has been awarded an order valued in excess of $3 million from a major Asian IC substrate manufacturer to deliver multiple state-of-the-art High Volume Manufacturing (HVM) 3D/2D metrology systems for production process monitoring and product yield enhancement. These latest-generation metrology systems will be assembled and shipped from Zygo's Tainan, Taiwan plant and operations center.

"This order is the culmination of a multi-year product development collaboration between our Semiconductor Advanced Packaging Systems Group engineering and applications teams and our customer. Our solution combines Zygo's core metrology expertize with a HVM-capable platform to provide true in-line process monitoring at industry-leading cost of ownership," stated Tony Allan, the Company's Chief Operating Officer. "This order further establishes Zygo as a leading supplier of process monitoring and yield enhancement tools for the high-growth Advanced Packaging market."

For more, visit www.zygo.com