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Of the four available methods to remove surface penetrant during the fluorescent penetrant inspection process, the hydrophilic post emulsifiable penetrant process (Method D) is used when tighter control of the penetrant process is desired.

The need for nondestructive evaluation on large quantity production components is becoming more achievable with CT technology due to the advances in machine hardware and processing techniques over the past few years.

Quality is the most frequently cited reason for reshoring manufacturing to the United States. According to the Reshoring Initiative’s 2017 Data Report, quality cost ranked number one as the most frequently mentioned negative factor experienced offshore from 2010 through 2017.

Keeping track of documents is essential for maintaining an audit-ready quality management system (QMS). 

It is true that magnetic particle testing (MT) is one of the oldest NDT methods, and over the years has proven itself to be not only reliable, but cost effective, when it is applied properly with qualified personnel. 

From airbags to air-conditioning units and fuel rails, from anything implanted in the body to hermetically sealed enclosures for integrated circuits, there are some instances where the acceptable leak rate is so small as to be practically zero. Few air leak test methods, such as pressure decay, have the necessary detection range.

"Data is the new oil!”  Clive Humby said over a decade ago, and his words seem even more apropos today. The allure of data is all-consuming—open any newspaper on any day of the week and at least half a dozen articles will speak about data.

Advanced manufacturers today are trending towards Industry 4.0—changing the way business runs. More emphasis is placed on access to real-time data from production and quality sources.

To choose the right 3D surface measurement tool, an engineer must carefully consider the size of the object, the speed of the scan and analysis, and a customer’s tolerance requirements.

IXYS UK Westcode, part of the global power semiconductor manufacturer, IXYS Corporation, is investing in its Chippenham, UK, factory to manufacture a new range of power semiconductor devices, which will be marketed alongside the company’s long-established Press-Pack Capsules (three-terminal power semiconductor devices).