When Wilhelm Rontgen discovered X-rays in the 1890s, he almost immediately discovered the imaging applications of this hitherto-unknown type of radiation, and experts in the medical community and the industrial nondestructive testing community rapidly seized on the potential this new science of radiography offered.
While x-ray inspection of electronics has existed for several decades, the continuous shift in electronics design and manufacturing to smaller, more dense products, is driving x-ray technology forward.
Radiographic inspection is a critical practice across multiple industries, and the development of non-film radiography provides enormous, yet currently untapped, potential to share these images widely and maximize resources.
In the automotive industry, quality control/assurance has often focused on the physical testing and evaluation of raw materials and finished products. From a safety perspective, it is imperative that the strength of these materials and products meets established standards. Tensile, compression, bending and hardness tests are used for these evaluations.
Medical device implants have become increasingly more complex over time as technology has progressed into providing a new way of construction by the means of 3D printing, also known as additive manufacturing.
Innovations in the electronics and semiconductor industries have birthed two relentless trends. Both profoundly impact both product designers and those charged with assuring that what was designed is what was manufactured. The trends are: higher densities for components, boards and processors, and the need for very high precision in the metal plating that enables functionality.
As one of the most common mechanical components in the world, roller elements are of critical importance. It is necessary for bearings and raceways to be carefully engineered and manufactured so that the machines which use them are as safe and stable as possible.
IXYS UK Westcode, part of the global power semiconductor manufacturer, IXYS Corporation, is investing in its Chippenham, UK, factory to manufacture a new range of power semiconductor devices, which will be marketed alongside the company’s long-established Press-Pack Capsules (three-terminal power semiconductor devices).